From: Frank
Date: 8/11/2005
Time: 8:11:31 AM
I'm trying to determine a sampling plan to be used for lot acceptance for solderability. The component has 300 leads; we receive it in lots of 500. Currently we are visually inspecting the tinned leads but as you know this 100% inspection is never 100% effective (fatigue etc.) The assumptions I'm making are that the tinning process the supplier uses is consistent and that all of the components were tinned at the same time. My SWAG at a lot acceptance sample is 4 or 5 parts. How would I calculate the risks etc involved with this plan.? Or do you have nay other suggestions at how I sample for this defect?